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| Rev. 1.0 BSP88 SIPMOS O Small-Signal-Transistor Feature * N-Channel * Enhancement mode * Logic Level * dv/dt rated Product Summary VDS RDS(on) ID 240 6 0.35 SOT-223 4 V W A 3 2 1 VPS05163 Type BSP88 Package SOT-223 Ordering Code Q67000-S070 Tape and Reel Information E6327: 3000 pcs/reel Marking BSP88 Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Symbol Continuous drain current TA=25C TA=70C Value 0.35 0.28 Unit A ID Pulsed drain current TA=25C ID puls dv/dt VGS Ptot Tj , Tstg 1.4 6 20 Class 1 1.8 -55... +150 55/150/56 W C kV/s V Reverse diode dv/dt IS=0.35A, V DS=192V, di/dt=200A/s, Tjmax=150C Gate source voltage ESD Sensitivity (HBM) as per MIL-STD 883 Power dissipation TA=25C Operating and storage temperature IEC climatic category; DIN IEC 68-1 Page 1 2002-11-12 Rev. 1.0 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - soldering point (Pin 4) SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 1) BSP88 Symbol min. RthJS RthJA 115 70 Values typ. max. 25 K/W Unit Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage V GS=0, ID=250A Symbol min. V(BR)DSS VGS(th) IDSS IGSS RDS(on) RDS(on) RDS(on) 240 0.6 Values typ. 1 max. 1.4 Unit V Gate threshold voltage, VGS = VDS ID=108A Zero gate voltage drain current V DS=240V, VGS=0, Tj=25C V DS=240V, VGS=0, Tj=150C A 1 4.9 4.6 4 0.1 10 10 15 7.5 6 nA W Gate-source leakage current V GS=20V, VDS=0 Drain-source on-state resistance V GS=2.8V, ID=0.014A Drain-source on-state resistance V GS=4.5V, ID=0.32A Drain-source on-state resistance V GS=10V, ID=0.35A 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2 2002-11-12 Rev. 1.0 Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed ISM Inverse diode forward voltage Reverse recovery time Reverse recovery charge VSD trr Qrr V GS=0, IF = I S V R=120V, IF=lS, diF/dt=100A/s BSP88 Values min. typ. 0.38 76 12 6 3.6 3.5 17.9 18.9 max. 95 15 9 5.4 5.2 26.8 28.3 ns S pF Unit Symbol Conditions g fs Ciss Coss Crss td(on) tr td(off) tf Q gs Q gd Qg V DS2*I D*RDS(on)max, ID=0.28A V GS=0, VDS=25V, f=1MHz 0.19 - V DD=120V, V GS=4.5V, ID=0.35A, R G=15W V DD=192V, ID=0.35A - 0.2 2 4.5 2.7 0.3 3 6.8 - nC V DD=192V, ID=0.35A, V GS=0 to 10V V(plateau) V DD=192V, ID = 0.35 A IS V TA=25C - 0.86 66 119 0.35 1.4 1.2 82 149 A V ns nC Page 3 2002-11-12 Rev. 1.0 1 Power dissipation Ptot = f (TA) 1.9 BSP88 BSP88 2 Drain current ID = f (TA) parameter: V GS 10 V 0.38 BSP88 W 1.6 1.4 A 0.32 0.28 Ptot 1 0.8 0.6 0.4 0.2 0 0 ID C 1.2 0.24 0.2 0.16 0.12 0.08 0.04 0 0 20 40 60 80 100 120 160 20 40 60 80 100 120 C 160 TA TA 3 Safe operating area ID = f ( V DS ) parameter : D = 0 , TA = 25 C 10 1 BSP88 4 Transient thermal impedance ZthJA = f (tp) parameter : D = t p/T 10 2 BSP88 A tp = 160.0s K/W 10 0 o S( n) /ID 1 ms RD 10 -1 10 ms ZthJA 10 0 = VD S 10 1 ID D = 0.50 0.20 0.10 0.05 0.02 0.01 10 -2 DC 10 -1 single pulse 10 -3 0 10 10 1 10 2 V 10 3 10 -2 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10 s 10 4 VDS Page 4 tp 2002-11-12 Rev. 1.0 5 Typ. output characteristic ID = f (VDS) parameter: Tj = 25 C, VGS 0.64 BSP88 6 Typ. drain-source on resistance RDS(on) = f (ID) parameter: Tj = 25 C, VGS 9 3.4V 3.8V 4V 0.48 4.4V 5V 6V 0.4 7V 10V 0.32 A 3.2V W 7 RDS(on) 6 5 4 3.4V 3.8V 4.4V 5V 6V 7V 10V 2.6V 3.2V ID 2.6V 0.24 3 0.16 2 1 0 0 0.08 0 0 0.5 1 1.5 2 2.5 3 V VDS 4 0.08 0.16 0.24 0.32 0.4 0.48 A ID 0.64 7 Typ. transfer characteristics ID= f ( VGS ); VDS 2 x ID x RDS(on)max parameter: Tj = 25 C 0.64 8 Typ. forward transconductance g fs = f(ID) parameter: Tj = 25 C 0.6 A S 0.48 ID 0.4 0.32 g fs 0.5 1 1.5 2 2.5 3.5 0.4 0.3 0.24 0.2 0.16 0.1 0.08 0 0 V 0 0 0.08 0.16 0.24 0.32 0.4 0.48 VGS Page 5 A ID 0.64 2002-11-12 Rev. 1.0 9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 0.35 A, VGS = 10 V W 30 BSP88 BSP88 10 Typ. gate threshold voltage VGS(th) = f (Tj) parameter: V GS = VDS; ID = 108 A 1.8 V 98% 24 1.4 RDS(on) 22 20 18 16 14 12 10 8 6 4 2 0 -60 -20 20 60 100 C VGS(th) 1.2 typ. 1 0.8 2% 0.6 98% typ 0.4 0.2 0 -60 180 -20 20 60 100 C 160 Tj Tj 11 Typ. capacitances C = f (VDS) parameter: V GS=0, f=1 MHz, Tj = 25 C 10 3 12 Forward character. of reverse diode IF = f (VSD) parameter: Tj 10 1 BSP88 pF A 10 2 C Ciss 10 0 Coss 10 1 Crss IF 10 -1 Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%) 10 0 0 5 10 15 20 V 30 10 -2 0 0.4 0.8 1.2 1.6 2 2.4 V 3 VDS VSD Page 6 2002-11-12 Rev. 1.0 13 Typ. gate charge VGS = f (QG ); parameter: VDS , ID = 0.35 A pulsed, Tj = 25 C 16 V BSP88 BSP88 14 Drain-source breakdown voltage V(BR)DSS = f (Tj) 291 BSP88 V 12 V(BR)DSS 0.5 VDS max nC 276 271 266 261 256 251 246 241 236 231 VGS 10 8 0.2 VDS max 6 0.8 V DS max 4 2 226 221 0 0 1 2 3 4 5 7 216 -60 -20 20 60 100 C 180 QG Tj Page 7 2002-11-12 Rev. 1.0 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. BSP88 Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 8 2002-11-12 |
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